Matsushita Electric's 4-layer package of LEDs through wafer level bonding (Figure)

Panasonic Electric Works has successfully developed a wafer-level bonding that integrates a package of LED-coated wafers and wafers equipped with photosensors into a total of four wafers. In order to demonstrate the technical strength of its Wafer Level Package (WLP), the company disclosed the component at the 20th Micromachine/MEMS Show.
This is a heat-dissipating wafer with 3-color LEDs, a light-reflecting wafer that reflects light in the front direction, a monitor wafer equipped with sensors (for sensing LED Light), and a dual function with light diffusion. Light extraction wafers. The heat sink wafer uses via wiring to remove heat from the bottom of the package.
Panasonic Electric Works has prototyped an illumination system that arrays the components. Led Light can be sensed by the light monitor, and the brightness of the LED can be controlled by feedback, so that light with uniform color and brightness can be emitted. Color and brightness can also be set arbitrarily.

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