New process validation specifications serve the automotive electronics market
The automobile production in the Chinese market has increased year by year. From 2008 to 2013, the compound annual growth rate of the Chinese automotive electronics market was 17.5%, while the global growth rate was only 8% at the same time. Moreover, the average semiconductor expense per vehicle in China is also increasing year by year. It is estimated that from 2008 to 2013, the compound annual growth rate of semiconductor expenditure per vehicle in China will be 7%. But for such a huge market demand, the proportion provided by Chinese IC design companies is very low.
Two major difficulties faced by automotive electronics
Why is it difficult for automotive electronics? There are two major differences between it and general IC:
First, the range of electronic operating temperature for vehicles is relatively large. For example, the IC used on the instrument panel is very different from the IC near the engine to the temperature, because the heat generated by the engine operation easily exceeds 150 ℃, so the IC near the engine must be more heat resistant.
Second, the requirements on reliability and quality are more demanding. Since automotive electronics have higher safety and reliability requirements than general consumer electronics products, the requirements for zero failure rate are much higher than consumer electronics ICs. In addition, the wear and tear of electronic components for vehicles is often accelerated due to the harsh operating environment. Therefore, the semiconductor process must ensure that the life of these electronic components can exceed the service life of the vehicle.
In response to the above two major requirements, the International Automobile Association's operating temperature for automotive electronic component products ranges from -40 ° C to + 150 ° C in Grade 0 to 0 ° C to + 70 ° C in Grade 4 in total. This product verification specification provides a fairly complete definition of automotive IC functions and their different locations. However, in terms of IC process verification specifications, the International Automotive Electronics Association has focused on the definition of chip manufacturing reliability tests. It does not clearly regulate the pressure conditions and any specific data standards, and the related data, testing and calculation methods are not active. provide.
If the Chinese semiconductor industry wants to grasp this wave of market growth opportunities, it needs the Chinese integrated circuit design industry and professional integrated circuit manufacturing service companies with successful experience to work together.
TSMC helps customers overcome obstacles
In order to help customers achieve the goals of high quality, reliability and zero failure rate of automotive electronic ICs, TSMC proposed the world ’s first set of more specific automotive electronic process verification specifications at the annual meeting of the International Automotive Electronics Association in 2008, with a clear definition And quantify the various chip verification specifications. At present, this set of specifications has been accepted and applied by many international automotive electronic semiconductor companies.
Before this more specific set of automotive electronic process verification specifications, customers must get the chip before testing. With this set of process verification specifications, TSMC can help customers check from the source to better ensure that the customer's electronic component life greatly exceeds the vehicle's service life.
At the same time, TSMC has developed a "vehicle electronic package service", which includes more stringent process control, component-level screening limits, chip yield test scrap criteria, more statistical process control, and selected manufacturing equipment Wait. These measures, in conjunction with the customer's test coverage and test methods, can further reduce the actual driving failure rate. After verification, the vehicle electronic package service can effectively reduce process variation and variation value.
TSMC's ten wafer fabs in Shanghai and all fabs worldwide have successfully provided the ability to provide automotive electronic package services, which can provide support and services to Chinese automotive integrated circuit design companies. TSMC is currently the world's first foundry company with automotive electronic process verification specifications and package services. Judging from the revenue distribution of various automotive electronic ICs in 2008, MCUs accounted for 1/4 of the total market turnover. A very important IC module in the MCU is embedded Flash. TSMC is the only embedded product in the world that can provide general customers with international automotive electronics industry standards (AEC-Q100) and covers two process generations (0.25 microns and 0.18 microns). Flash company. As of now, TSMC is the only professional integrated circuit manufacturing company in the world that produces more than 1 million 8-inch automotive electronic chips.
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