Micromachining has become a cornerstone of miniaturization in sensor technology. By reducing the size of the sensing element, it enables significant reductions in system size through standard semiconductor fabrication techniques. Integrated signal processing further enhances this miniaturization by embedding processing capabilities directly with the sensor, eliminating the need for external connections. The choice of micromachining technology often dictates the limits of miniaturization, but this is typically influenced by the type of sensor being used. For example, piezoelectric micromechanical components for pressure sensing can be built on CMOS silicon substrates, such as suspended membranes, offering improved performance and compactness.
The integration of multiple functions into a single sensor also helps reduce overall system size. This is particularly evident in 6-axis accelerometers, where well-designed elements can provide motion data across multiple axes. While this approach allows for smaller systems, it may come at the cost of increased noise and reduced dynamic range. For instance, adding filtering and signal processing to differentiate forces on a composite sensing element can lead to slower response times and lower dynamic range. Although acceptable for applications like wearable electronics, it might not meet the higher accuracy demands of small unmanned aerial vehicles (UAVs).
Plasma treatment plays a key role in enhancing the performance of micromachined sensors. The Kionix KXCJ9 is a 3-axis micromechanical accelerometer that uses plasma micromachining technology. Its design employs differential capacitance to detect acceleration, with a common mode rejection technique that minimizes errors caused by temperature and environmental pressure changes. The sensing element is hermetically sealed using a second silicon wafer, helping to reduce the device’s size while maintaining performance.
This sensor is housed in a compact LGA package measuring 3 x 3 x 0.9 mm, operating from a 1.8–3.6 VDC power supply. An internal regulator ensures stable operation across the voltage range, eliminating the need for external power adjustments and further reducing the design footprint.
Pressure sensing also benefits from micromachining. The ST LPS25H is an ultra-compact absolute pressure sensor featuring a monolithic piezoresistive element fabricated on a single silicon substrate. This design allows for significantly smaller sensing elements compared to traditional microfilm constructions. The sensor offers a measurement range of 260 to 1260 hPa and is suitable for applications such as sports watches and weather stations.
The LPS25H is packaged in a 10-pin HCLGA package measuring 2.5 x 2.5 x 1 mm, allowing external pressure to reach the sensing element. It includes a 24-bit ADC, adjustable output data rate, and operates over a wide temperature range from -30°C to +105°C, making it ideal for various environments.
Combining data from multiple sensor axes is increasingly used in user interfaces, such as gesture recognition. The Freescale MMA8451Q is a triaxial capacitive accelerometer that fits into a 3 x 3 x 1 mm QFN package. It provides 14-bit resolution and supports motion detection based on static or dynamic acceleration changes. The device can detect taps, gestures, and tilts, making it suitable for smart devices and wearables. It includes high-pass and low-pass filters to separate static and dynamic components of acceleration, enabling more accurate gesture recognition.
In conclusion, different micromachining techniques offer designers various options for achieving miniaturization. From integrated signal processing to multi-axis sensor fusion, these technologies help reduce system size. However, the underlying sensor technology can impose limitations on performance, so careful selection is essential when pursuing miniaturization.
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