Common connection methods of LCD and IC

Common connection methods of LCD and IC

COB --- English abbreviation for "Chip On Board". That is, the chip is bonded on the PCB.

TAB --- English "Tape Aotomated Bonding" abbreviation. That is, anisotropic conductive adhesive connection. The IC with the package form TCP (Tape Carrier Package) is fixed on the LCD and the PCB with anisotropic conductive adhesive, respectively.
This installation method can reduce the weight, volume, convenient installation and good reliability of LCM!

COG --- English abbreviation for "Chip On Glass". That is, the chip is directly bonded on the glass. This installation method can greatly reduce the size of the entire LCD module, and is easy to mass-produce. It is suitable for LCDs for consumer electronics products, such as mobile phones,
PDA and other portable electronic products.

COF-the abbreviation of "Chip On Film" in English. That is, the chip is directly mounted on the flexible PCB. This connection is highly integrated, and peripheral components can be mounted on the flexible PCB together with the IC, which is an emerging technology.

SMT --- English abbreviation for "Surface mount technology". That is surface mounting technology, which is a more traditional installation method. The disadvantage is its large size, which limits the miniaturization of LCM.

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