Toshiba Introduces MIPI® CSI2 Interface Bridge IC with Integrated De-interlacing and Video Scaling

Helps reduce video preprocessing load in the host processor

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Toshiba Introduces MIPI® CSI2 Interface Bridge IC with Integrated De-interlacing and Video Scaling

Toshiba announced that it has introduced the "T358749XBG", an interface bridge IC between HDMI® and the Mobile Industry Processor Interface (MIPI®), which integrates video deinterlacing and video scaling. Samples have been released and mass production is scheduled to begin in December this year.

The new IC's integrated video pre-interlacing, video scaling and video format conversion video pre-processing capabilities can replace software processing and significantly reduce the storage bandwidth and video processing requirements of host processors deployed in consumer electronics.

The IC supports a wide range of audio interfaces, including I2S, TDM, S/PDIF, and MIPI® Serial Low-power Inter-chip Media Bus (SLIMbus®) for a wide range of applications.

Main characteristics

Integrated video deinterlacing, video scaling and video format conversion to help reduce storage bandwidth and video processing requirements in the host processor

Support for HDMI® 1.4

  • Up to 1080P @60fps video format (RGB, YcbCr444: 24-bpp, YcbCr422 24-bpp)
  • HDCP 1.3
  • Support 3D

Supports the following four audio interfaces: I2S, TDM, SPDIF or SLIMbus®

Maximum 1Gbps connection speed per channel MIPI® CSI2 interface

Maximum 165MHz HDMI clock speed

application

Can be used in a wide range of consumer electronics and industrial applications such as smart set-top boxes, smart TVs, smart displays and small form factor PCs

Main specifications

Toshiba Introduces MIPI® CSI2 Interface Bridge IC with Integrated De-interlacing and Video Scaling

Note:

* HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.

* MIPI and SLIMbus are registered trademarks of MIPI Alliance, Inc.

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