China's semiconductor packaging companies are not off-season

China's semiconductor packaging companies are not off-season

Recently, leading global semiconductor companies have stated that they will continue to increase investment and cooperation in mainland China. Unlike previous cooperation, cooperation has not taken human costs and financing costs as the biggest attraction, mainly involving the most advanced of leading enterprises. technology.

On December 15th, MediaTek and wafer foundry firm Huali Microelectronics jointly announced that they will cooperate closely in the 28nm process technology and wafer manufacturing services. The foundry of some mobile communications processors of MediaTek will be handed over by Huali Micro. Electronic finish. MediaTek has once again deepened its cooperation with the mainland industrial chain and transferred some of its production capacity to the mainland. Coincidentally, on the 15th, TSMC founder Zhang Zhongmou also said that TSMC will help mainland companies develop their own chip production capacity, and hopes to provide support in the mainland's recent semiconductor development plan.

28 nanometer technology has received great attention from the industry. Not only is 28nm the best technology on the horizon, but also its vitality is expected to continue for a long time. Under the guidance of Moore's Law, the line width of ICs has continuously narrowed. It has basically been reduced to 70% of the original size every two years. The cost has also dropped significantly, and this law has reached a width of 28 nm. Already unable to maintain. According to industry sources, as QUALCOMM and TSMC ramped up the production of 28nm process in 2013 and entered 22nm and 14nm in succession, the cost did not drop but increased, and the power consumption of the 28nm process compared to the 40nm chip can be reduced. About 45% of its vitality is expected to last more than 10 years.

Previously, MediaTek has transferred some of its production capacity of baseband chips for mobile communications, wireless and connected IC products to Huali Microelectronics. Since the beginning of this year, Qualcomm and SMIC have cooperated closely in the 28-nm process. MediaTek also cooperated with 28-nm process technology and Huali Microelectronics on the mainland, which also demonstrated that the mainland integrated circuit industry has reached the highest level of capacity transfer. techinque level.

Not only is the 28-nanometer technology, but the process of transferring the wafer-level packaging industry to the mainland is also accelerating. Wafer-level packaging represents the future technological development trend of the packaging industry. Currently, it is mainly used for image sensor chips, MEMS sensors, and biometric identification chips. As the only company in China with wafer-level testing, assembly and other complete technologies, Quncheng Technology cooperates with China Huaxin Semiconductor and expects to invest US$1 billion in wafer-level packaging industry development.

With the support of integrated circuit industry policies, the prosperity of the semiconductor industry is far greater than that of overseas companies. The data of Huanxu Electronics (30.05, -0.34, -1.12%) showed that its November revenue reached 1.587 billion yuan, up from the previous month in October. Other packaging companies also said that in the fourth quarter of this year, the off-season is not faded. "The situation.

Tongfu Microelectronics (8.66, -0.20, -2.26%) is a strategic partner of Huali Micro in the mid-bumping segment and is also one of the major suppliers for MediaTek. It is reported that the company's revenue from MediaTek this year exceeds 150 million yuan. Jingfang Technology (44.03, -0.59, -1.32%) focuses on wafer-level packaging, ranks second in the world's professional wafer-level packaging and testing companies, and has taken the lead in realizing the volume of 12-inch wafer-level packaging processes. Production.

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