Definition of LED thermal management

LED thermal management techniques include thermal management of chips, packages, and system integration. On the chip side, people are striving to improve the quality of the material or design new structures to improve the internal and external quantum efficiency of the chip itself, and have lower thermal resistance than traditional low thermal conductivity sapphire substrate chips.

Chip (quantum efficiency; power density; heat flow extension; substrate material, etc.)

LED thermal management package (package material, package structure, package process, etc.)

System Integration (Refrigeration Technology; Materials; Processes, etc.)

LED heat dissipation structure description (illustration path: illustration \ LED heat dissipation structure description)

1. The necessity of LED heat dissipation (dissipation problem is the technical bottleneck of current semiconductor lighting technology)

The LED is an optoelectronic device. Only 10% to 40% of the electrical energy in the working process is converted into light energy. The rest of the power is converted into heat energy, which increases the temperature of the LED. LED temperature rise is the main cause of LED performance degradation and failure. LED junction temperature rises, resulting in lower luminous efficiency, poor reliability, reduced service life, and increased heat generation.

2. Solution

LED thermal management

(A) Improved LED chip, package structure and materials - completion of upstream and midstream industries

(B) System integration, focusing on heat dissipation of lamps and improving heat transfer power - heat dissipation design

3, LED lamp heat dissipation structure analysis

Chip (node ​​temperature controlled at <85°C)—(The product with small thermal resistance is conducive to heat dissipation) — Lamp Beads—Aluminum Substrate (Increased copper area is conducive to heat conduction) — (Using thermal silica) — Radiator Shell Lamp (Good structure facilitates air convection) - Surrounding environment