JEDEC Announces Major Features of the Upcoming UFS Standard

The JEDEC Solid State Technology Association, the global standard-setting body for the microelectronics industry, has selectively announced the main features of the widely anticipated UFS. The UFS standard, which is expected to be released later in 2010, is the next generation of flash memory specifications designed to provide higher performance and faster flash memory for use in laptops, mobile phones (including smart phones) and other consumer electronics products. Data transmission rate.

At the recent JEDEC JC-64 committee meeting in Toronto, Mr. Deming Qiao, chairman of the Flash Memory Modules Committee, stated: “By bringing together major consumer electronics, mobile and smart phone OEMs, and major chip makers, JEDEC Has the ability to ensure that UFS can meet the latest needs of the mobile industry." He also pointed out, "UFS design is not only limited to meet the needs of the moment, but also have the flexibility required to meet future equipment requirements."

The UFS architecture is more suitable for high-performance mobile computing. Compared to the current e.MMCTM, an embedded non-volatile memory system standard, UFS will provide significant performance improvements. UFS will adopt and optimize some features of e•MMC, including the high priority interrupt feature included in the recently updated e•MMC v4.41 release. The UFS design will also include improved random access capabilities and synchronous read/write data streams. Both are designed to improve the performance of the device.

Some other features of the JEDEC UFS standard will include:

• The functional definition of the UFS standard will take full advantage of the performance gains achieved by next-generation flash media access standards such as ONFi and Toggle Mode.

Based on leading industry interface standards, such as M-PHY and UniProSM standards for the Mobile Industry Processor Interface (MIPISM) Alliance.

UFS adopts the widely accepted SCSI standard as a set of instructions and provides UFS-specific features including security, partitioning, erasure/trimming, and more.

· The layered architecture including the physical layer, link, translation, and protocol layers with complete functions at all levels work together to achieve the best performance and functionality of advanced UFS storage devices.

• Mechanical specification design suitable for both embedded package ball outputs and removable memory cards provides high-speed signal transmission without degrading signal integrity.