Introduction: [Nikkei BP News Agency] Japan Gore-Tex (Headquarters: Tokyo) exhibited liquid crystal polymer at "JPCA Show 2007" (May 30, 2007 - June 1, 2007, BigSight, Tokyo) LCP) flexible laminate prototype for film. According to the company, a "curved surface" product can be produced by mounting an LED chip in a recess formed by press working and performing resin encapsulation.
The company claims that this flexible backplane is a "3D flexible recessed backplane." The basic structure of the substrate is to form a copper (Cu) pattern on the LCP film and to plate silver (Ag) on ​​the copper pattern. On the basis of this, a concave portion is formed by press working, and an LED chip is mounted on the concave portion. LED chips can be packaged using common mounting equipment and reflow ovens, as well as lead-free (Pb) solder.
The LCP used in the flexible bottom plate has substantially the same thermal expansion coefficient (linear expansion ratio) in the X and Y directions, and the linear expansion ratio is the same as that of the copper pattern. Therefore, the possibility of peeling off the LCP film and the copper pattern during press working is very good.
In addition, because the LCP film and silver plating are almost white, the bottom plate has the feature of "capable of reflecting the color of the LED" (the company's commentator). Since the brown polyimide (PI) film does not have this property, the company uses an LCP film. (Reporter: Takano Den)
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Figure 1: Tape-like LCP flexible bottom plate ![]()
Figure 2: After the LED chip is mounted on the backplane ![]()
Figure 3: Figure 2 combined with a diffuser to form a surface illuminator ![]()
Figure 4: LCP flexible bottom plate formed with matrix recesses
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Figure 5: Observing the concave part of Figure 4 through a magnifying glass Source: http://china.nikkeibp.co.jp/china/news/flat/pr_flat200706050115.html
The company claims that this flexible backplane is a "3D flexible recessed backplane." The basic structure of the substrate is to form a copper (Cu) pattern on the LCP film and to plate silver (Ag) on ​​the copper pattern. On the basis of this, a concave portion is formed by press working, and an LED chip is mounted on the concave portion. LED chips can be packaged using common mounting equipment and reflow ovens, as well as lead-free (Pb) solder.
The LCP used in the flexible bottom plate has substantially the same thermal expansion coefficient (linear expansion ratio) in the X and Y directions, and the linear expansion ratio is the same as that of the copper pattern. Therefore, the possibility of peeling off the LCP film and the copper pattern during press working is very good.
In addition, because the LCP film and silver plating are almost white, the bottom plate has the feature of "capable of reflecting the color of the LED" (the company's commentator). Since the brown polyimide (PI) film does not have this property, the company uses an LCP film. (Reporter: Takano Den)
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